Chip transferring method and the apparatus thereof

A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring a photoelectric characteristic value of each of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelec...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Hsieh, Min-Hsun, Kuo, De-Shan, Yang, Jhih-Yong, Lee, Chang-Lin
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring a photoelectric characteristic value of each of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic value of each of the plurality of chips; providing a second load-bearing structure; weakening a first adhesion between the first portion chips and the first load-bearing structure or between the second portion chips and the first load-bearing structure; and transferring the first portion chips or the second portion chips to the second load-bearing structure.