Semiconductor device having inner lead exposed from sealing resin, semiconductor device manufacturing method thereof, and power converter including the semiconductor device

Semiconductor device having inner lead exposed from sealing resin, semiconductor device manufacturing method thereof, and power converter including the semiconductor device

Inner leads having die pads having upper surfaces to which semiconductor elements are mounted each have a stepped profile, and surfaces of portions of the inner leads are exposed from a sealing resin in plan view. Outer leads connected to the inner leads have first bends at side surfaces of the seal...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Ichikawa, Keitaro
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORSOR DYNAMO-ELECTRIC CONVERTERS
CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Inner leads having die pads having upper surfaces to which semiconductor elements are mounted each have a stepped profile, and surfaces of portions of the inner leads are exposed from a sealing resin in plan view. Outer leads connected to the inner leads have first bends at side surfaces of the sealing resin to extend in a direction on a side of the upper surfaces of the die pads, so that a miniaturized semiconductor device can be obtained.