Hybrid thermal cooling system

Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC),...

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Bibliographische Detailangaben
Hauptverfasser: Liu, Tim, Ku, Jeff, Jagadish, Harish, Wang, Ivan By, Jiang, Jason Y, Juan, Gerry, Liu, Sammi Wy, Sung, Gavin
Format: Patent
Sprache:eng
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Zusammenfassung:Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.