Fast flow cooling bath for multiprocessor circuit boards

Fast flow cooling bath for multiprocessor circuit boards

A system and a method are disclosed for a cooling bath designed to cool a high density of devices within the bath. Coolant is circulated between the cooling bath and external pumps, which use a high flow rate of coolant to cool the high density of devices. The cooling bath includes inlet pipes, dist...

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1. Verfasser: Kirillov, Ivan
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator Kirillov, Ivan
description A system and a method are disclosed for a cooling bath designed to cool a high density of devices within the bath. Coolant is circulated between the cooling bath and external pumps, which use a high flow rate of coolant to cool the high density of devices. The cooling bath includes inlet pipes, distribution pipes, a device chamber, and draining sections. The inlet pipes and distribution pipes are structured such that a mound of coolant may accumulate within the bath, forming a peak near the center of the bath. Coolant flows in a direction from the center of the bath towards draining sections on opposing ends of the bath. Draining sections are structured to receive hot coolant at a relatively slow flow rate and prevent air from being expelled from the cooling bath with the hot coolant.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Fast flow cooling bath for multiprocessor circuit boards
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