Fast flow cooling bath for multiprocessor circuit boards

A system and a method are disclosed for a cooling bath designed to cool a high density of devices within the bath. Coolant is circulated between the cooling bath and external pumps, which use a high flow rate of coolant to cool the high density of devices. The cooling bath includes inlet pipes, distribution pipes, a device chamber, and draining sections. The inlet pipes and distribution pipes are structured such that a mound of coolant may accumulate within the bath, forming a peak near the center of the bath. Coolant flows in a direction from the center of the bath towards draining sections on opposing ends of the bath. Draining sections are structured to receive hot coolant at a relatively slow flow rate and prevent air from being expelled from the cooling bath with the hot coolant.