Contact

[Object] To provide a contact that can hold down effects caused by solder, even if an elastic contacting portion is extending from a location contacting a first member.[Solving means] The contact includes a base portion, an elastic contacting portion and a gap forming portion. The base portion is co...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Nakamura, Tatsuya, Yada, Tetsuya
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:[Object] To provide a contact that can hold down effects caused by solder, even if an elastic contacting portion is extending from a location contacting a first member.[Solving means] The contact includes a base portion, an elastic contacting portion and a gap forming portion. The base portion is configured solderable on a component mounting surface of the first member. The elastic contacting portion is configured elastically deformable and relatively swingable with respect to the base portion, and when contacting a contacted surface of the second member, is configured to elastically deform to be in pressurized contact with the contacted surface. In the gap forming portion, a concave portion is provided between a first end portion and a second end portion, and is configured to have a gap between the concave portion and the component mounting surface when the base portion is soldered on the component mounting surface in a state in which the concave portion and the component mounting surface are oriented in directions facing each other.