Metal powder sintering paste and method of producing the same, and method of producing conductive material

There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that c...

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Bibliographische Detailangaben
Hauptverfasser: Kunimune, Teppei, Kuramoto, Masafumi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.