Process for producing a plate heat exchanger and plate heat exchanger

A plate heat exchanger has two metal plates brought into abutment, with a solder material between the plates. The plates are heated up to a first temperature. The plates are placed into a mold, the mold surfaces of which have cavities for envisaged channel structures. Channel structures are formed b...

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Bibliographische Detailangaben
Hauptverfasser:	Boehnke, Max, Rusche, Ulrich, Grussmann, Elmar, Huschen, Ulrich, Grewe, Jochem
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CLADDING OR PLATING BY SOLDERING OR WELDING COMBINED OPERATIONS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MACHINE TOOLS MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR OTHER WORKING OF METAL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING UNIVERSAL MACHINE TOOLS WEAPONS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A plate heat exchanger has two metal plates brought into abutment, with a solder material between the plates. The plates are heated up to a first temperature. The plates are placed into a mold, the mold surfaces of which have cavities for envisaged channel structures. Channel structures are formed by local internal pressure forming of at least one plate under pressurization by the tool. The plates are heated up to a second temperature. The plates are solder bonded at the abuted surfaces. A plate heat exchanger has two metal plates, wherein channel structures have been formed in at least one plate and the plates are bonded to one another by soldering away from the channel structures. Eutectic microstructures having a longest extent of less than 50 micrometers are formed in the solder layer.