Curable and cured adhesive compositions

Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10−4) inverse Pascals at 25° C., a creep compliance that is gr...

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Bibliographische Detailangaben
Hauptverfasser:	Behling, Ross E, Everaerts, Albert I, Benson, Karl E, Ellis, Mark F, Clapper, Jason D, Ting, Chun-Yi, Xia, Jianhui
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON DYES GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES WORKING-UP
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Beschreibung
Zusammenfassung:	Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10−4) inverse Pascals at 25° C., a creep compliance that is greater than 1(10−3) inverse Pascals at 70° C., and a shear storage modulus greater than 40 kiloPascals when measured at 25° C. at a frequency of 1 radian/second.