Hardware deprocessing using voltage imaging for hardware assurance

Embodiments of the present disclosure provide methods, apparatus, systems, computing devices, computing entities for setting deprocessing parameters used in conducting hardware deprocessing on a hardware. In accordance with one embodiment, a method is provided that includes: receiving sample images using different E-beam voltages, wherein each image is captured from a backside of the hardware using a different E-beam voltage; generating thickness-based contour maps, wherein each map is generated for an image and includes contour lines indicating locations having a same thickness of remaining material; generating estimated E-beam penetration depths, wherein each depth is generated for an image and is based at least in part on the E-beam voltage used to capture the image; generating an estimated thickness measurement of the remaining material based at least in part on the contour maps and the penetration depths; and setting the deprocessing parameters based at least in part on the estimated thickness measurement.