Connection terminal pattern and layout for three-level buck regulator

Certain aspects of the present disclosure generally relate to a connection terminal pattern and layout for a three-level buck regulator. One example electronic module generally includes a substrate, an integrated circuit (IC) package disposed on the substrate and comprising transistors of a three-le...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Low, Zhen Ning, Guo, Guoyong, Yu, Chengyue, Chen, Jiwei
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Certain aspects of the present disclosure generally relate to a connection terminal pattern and layout for a three-level buck regulator. One example electronic module generally includes a substrate, an integrated circuit (IC) package disposed on the substrate and comprising transistors of a three-level buck regulator, a capacitive element of the three-level buck regulator disposed on the substrate, and an inductive element of the three-level buck regulator disposed on the substrate. In certain aspects, the capacitive element and the inductive element may be disposed adjacent to different sides of the IC package.