Dimension measurement apparatus, dimension measurement program, and semiconductor manufacturing system

The disclosure relates to a dimension measurement apparatus that reduces time required for dimension measurement and eliminates errors caused by an operator. Therefore, the dimension measurement apparatus uses a first image recognition model that extracts a boundary line between a processed structur...

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Bibliographische Detailangaben
Hauptverfasser: Okuyama, Yutaka, Ohmori, Takeshi, Toyoda, Yasutaka
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The disclosure relates to a dimension measurement apparatus that reduces time required for dimension measurement and eliminates errors caused by an operator. Therefore, the dimension measurement apparatus uses a first image recognition model that extracts a boundary line between a processed structure and a background over the entire cross-sectional image and/or a boundary line of an interface between different kinds of materials, and a second image recognition that output information for dividing the boundary line extending over the entire cross-sectional image obtained from the first image recognition model for each unit pattern constituting a repetitive pattern, obtains coordinates of a plurality of feature points defined in advance for each unit pattern, and measures a dimension defined as a distance between two predetermined points of the plurality of feature points.