Shape-memory heat absorbers

In one aspect, a device may include a housing, at least one processor within the housing, storage accessible to the at least one processor and within the housing, and plural heat absorbers within the housing that may be spherical. Each heat absorber may include an outer shell and inner material. The...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Wong, Tin-Lup, Jakes, Philip John, Yebka, Bouziane, Holung, Joseph Anthony
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:In one aspect, a device may include a housing, at least one processor within the housing, storage accessible to the at least one processor and within the housing, and plural heat absorbers within the housing that may be spherical. Each heat absorber may include an outer shell and inner material. The outer shell may include a shape-memory material. The inner material may include phase-change material different from the shape-memory material. The melting point of the phase-change material may be lower than the melting point of the shape-memory material. The heat absorbers may be juxtaposed with one or more other components of the device to absorb heat from the one or more other components.