Sound damping wallboard and method of constructing a sound damping wallboard

A sound damping wallboard for installation on an installed wallboard, a sound damping wallboard system, and a method of constructing a sound damping wallboard on a building structure are disclosed. The sound damping wallboard includes a gypsum layer having a gypsum layer inner surface and a gypsum l...

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Bibliographische Detailangaben
Hauptverfasser:	Wilson, Tommy, Randall, Brian G, Blades, Michael N, Hawk, Jeff, Bailey, Joseph J
Format:	Patent
Sprache:	eng
Schlagworte:	ACOUSTICS ACOUSTICS NOT OTHERWISE PROVIDED FOR BUILDING BUILDING MATERIALS CEILINGS CHEMISTRY COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS FIXED CONSTRUCTIONS FLOORS GENERAL BUILDING CONSTRUCTIONS INORGANIC CHEMISTRY INSULATION OR OTHER PROTECTION OF BUILDINGS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING,NOISE OR OTHER ACOUSTIC WAVES IN GENERAL MUSICAL INSTRUMENTS PERFORMING OPERATIONS PHYSICS ROOFS SOUND-PRODUCING DEVICES STRUCTURAL ELEMENTS TRANSPORTING WALLS, e.g. PARTITIONS
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Beschreibung
Zusammenfassung:	A sound damping wallboard for installation on an installed wallboard, a sound damping wallboard system, and a method of constructing a sound damping wallboard on a building structure are disclosed. The sound damping wallboard includes a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface, a first sound damping layer disposed at the gypsum layer inner surface and having a first sound damping layer inner surface opposite the gypsum layer inner surface, a first encasing layer disposed at the gypsum layer outer surface, a second encasing layer disposed at the first sound damping layer inner surface, and a second sound damping layer disposed at the second encasing layer opposite the first sound damping layer inner surface.