Substrate thermal layer for heat spreader connection
A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate having a first layer over a second layer. The first layer may have greater thermal conductivity than the second layer. The semiconductor device package structure further includes one...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate having a first layer over a second layer. The first layer may have greater thermal conductivity than the second layer. The semiconductor device package structure further includes one or more dies coupled to the substrate. A heat spreader may have a first section coupled to a first surface of a first die of the one or more dies, and a second section coupled to the first layer. |
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