Systems and methods for reducing pressure while shaping a film

Systems and methods of shaping a patterned or planarized film layer. Which may include contacting formable material on a substrate with a template during a contacting period, Which may also include reducing, during the contacting period, a pressure in an environment beyond an edge of the substrate f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Khusnatdinov, Niyaz, Meissl, Mario Johannes, Bamesberger, Seth J
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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