Systems and methods for reducing pressure while shaping a film

Systems and methods for reducing pressure while shaping a film

Systems and methods of shaping a patterned or planarized film layer. Which may include contacting formable material on a substrate with a template during a contacting period, Which may also include reducing, during the contacting period, a pressure in an environment beyond an edge of the substrate f...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Khusnatdinov, Niyaz, Meissl, Mario Johannes, Bamesberger, Seth J
Format: Patent
Sprache:eng
Schlagworte:
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:Systems and methods of shaping a patterned or planarized film layer. Which may include contacting formable material on a substrate with a template during a contacting period, Which may also include reducing, during the contacting period, a pressure in an environment beyond an edge of the substrate from a first pressure to a second pressure, while the template is contacting the formable material.