Enhanced automatic wafer centering system and techniques for same

Systems and techniques for determining and correcting inter-wafer misalignments in a stack of wafers transported by a wafer handling robot. An enhanced automatic wafer centering system is provided that may be used to determine a smallest circle associated with the stack of wafers, which may then be...

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Bibliographische Detailangaben
Hauptverfasser: Mooring, Benjamin Wayne, Thaulad, Peter S, Herzig, Brett M, Blank, Richard M
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Systems and techniques for determining and correcting inter-wafer misalignments in a stack of wafers transported by a wafer handling robot. An enhanced automatic wafer centering system is provided that may be used to determine a smallest circle associated with the stack of wafers, which may then be used to determine whether or not the stack of wafer meets various process requirements and/or if a centering correction can be made to better align the wafers with a receiving station coordinate frame.