Attachment method for microfluidic device

A microfluidic device includes a silicon device and a metallic component. The silicon device and the metallic component are attached by preparing a surface of a silicon device to be solderable, preparing a corresponding surface of a metallic component to be solderable, and soldering the prepared sur...

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creator Lord, Peter C
description A microfluidic device includes a silicon device and a metallic component. The silicon device and the metallic component are attached by preparing a surface of a silicon device to be solderable, preparing a corresponding surface of a metallic component to be solderable, and soldering the prepared surface of the silicon device to the corresponding prepared surface of the metallic component with a solder of a pre-defined composition and thickness to accommodate strain due to co-efficient of thermal expansion (CTE) mismatch between the silicon device and the metallic component.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11571692B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11571692B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11571692B23</originalsourceid><addsrcrecordid>eNrjZNB0LClJTM7ITc0rUchNLcnIT1FIyy9SyM1MLspPyynNTMlMVkhJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYaGpuaGZpZGTkbGxKgBABWxKP8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Attachment method for microfluidic device</title><source>esp@cenet</source><creator>Lord, Peter C</creator><creatorcontrib>Lord, Peter C</creatorcontrib><description>A microfluidic device includes a silicon device and a metallic component. The silicon device and the metallic component are attached by preparing a surface of a silicon device to be solderable, preparing a corresponding surface of a metallic component to be solderable, and soldering the prepared surface of the silicon device to the corresponding prepared surface of the metallic component with a solder of a pre-defined composition and thickness to accommodate strain due to co-efficient of thermal expansion (CTE) mismatch between the silicon device and the metallic component.</description><language>eng</language><subject>BLASTING ; CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE ; DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY ; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR ; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROMTHE BODY ; HEATING ; HUMAN NECESSITIES ; HYGIENE ; LIGHTING ; MECHANICAL ENGINEERING ; MEDICAL OR VETERINARY SCIENCE ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; PUMPS ; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS ; TRANSPORTING ; WEAPONS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230207&amp;DB=EPODOC&amp;CC=US&amp;NR=11571692B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230207&amp;DB=EPODOC&amp;CC=US&amp;NR=11571692B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Lord, Peter C</creatorcontrib><title>Attachment method for microfluidic device</title><description>A microfluidic device includes a silicon device and a metallic component. The silicon device and the metallic component are attached by preparing a surface of a silicon device to be solderable, preparing a corresponding surface of a metallic component to be solderable, and soldering the prepared surface of the silicon device to the corresponding prepared surface of the metallic component with a solder of a pre-defined composition and thickness to accommodate strain due to co-efficient of thermal expansion (CTE) mismatch between the silicon device and the metallic component.</description><subject>BLASTING</subject><subject>CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE</subject><subject>DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY</subject><subject>DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR</subject><subject>DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROMTHE BODY</subject><subject>HEATING</subject><subject>HUMAN NECESSITIES</subject><subject>HYGIENE</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>MEDICAL OR VETERINARY SCIENCE</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>PUMPS</subject><subject>PUMPS FOR LIQUIDS OR ELASTIC FLUIDS</subject><subject>TRANSPORTING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB0LClJTM7ITc0rUchNLcnIT1FIyy9SyM1MLspPyynNTMlMVkhJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYaGpuaGZpZGTkbGxKgBABWxKP8</recordid><startdate>20230207</startdate><enddate>20230207</enddate><creator>Lord, Peter C</creator><scope>EVB</scope></search><sort><creationdate>20230207</creationdate><title>Attachment method for microfluidic device</title><author>Lord, Peter C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11571692B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BLASTING</topic><topic>CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE</topic><topic>DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY</topic><topic>DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR</topic><topic>DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROMTHE BODY</topic><topic>HEATING</topic><topic>HUMAN NECESSITIES</topic><topic>HYGIENE</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>MEDICAL OR VETERINARY SCIENCE</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>PUMPS</topic><topic>PUMPS FOR LIQUIDS OR ELASTIC FLUIDS</topic><topic>TRANSPORTING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>Lord, Peter C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Lord, Peter C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Attachment method for microfluidic device</title><date>2023-02-07</date><risdate>2023</risdate><abstract>A microfluidic device includes a silicon device and a metallic component. The silicon device and the metallic component are attached by preparing a surface of a silicon device to be solderable, preparing a corresponding surface of a metallic component to be solderable, and soldering the prepared surface of the silicon device to the corresponding prepared surface of the metallic component with a solder of a pre-defined composition and thickness to accommodate strain due to co-efficient of thermal expansion (CTE) mismatch between the silicon device and the metallic component.</abstract><oa>free_for_read</oa></addata></record>
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language eng
recordid cdi_epo_espacenet_US11571692B2
source esp@cenet
subjects BLASTING
CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY
DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROMTHE BODY
HEATING
HUMAN NECESSITIES
HYGIENE
LIGHTING
MECHANICAL ENGINEERING
MEDICAL OR VETERINARY SCIENCE
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
PUMPS
PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
TRANSPORTING
WEAPONS
title Attachment method for microfluidic device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T14%3A54%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Lord,%20Peter%20C&rft.date=2023-02-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11571692B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true