Attachment method for microfluidic device

A microfluidic device includes a silicon device and a metallic component. The silicon device and the metallic component are attached by preparing a surface of a silicon device to be solderable, preparing a corresponding surface of a metallic component to be solderable, and soldering the prepared sur...

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Bibliographische Detailangaben
1. Verfasser:	Lord, Peter C
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROMTHE BODY HEATING HUMAN NECESSITIES HYGIENE LIGHTING MECHANICAL ENGINEERING MEDICAL OR VETERINARY SCIENCE MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS PUMPS PUMPS FOR LIQUIDS OR ELASTIC FLUIDS TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	A microfluidic device includes a silicon device and a metallic component. The silicon device and the metallic component are attached by preparing a surface of a silicon device to be solderable, preparing a corresponding surface of a metallic component to be solderable, and soldering the prepared surface of the silicon device to the corresponding prepared surface of the metallic component with a solder of a pre-defined composition and thickness to accommodate strain due to co-efficient of thermal expansion (CTE) mismatch between the silicon device and the metallic component.