Semiconductor processing with cooled electrostatic chuck

Embodiments described herein relate to a substrate support assembly. The substrate support assembly includes an ESC base assembly having a base channel disposed therein, a facility plate, the facility plate coupled to the ESC base assembly with a vacuum region therebetween, and a seal assembly. The...

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Bibliographische Detailangaben
Hauptverfasser: Sarode Vishwanath, Yogananda, Prouty, Stephen Donald, Noujaim, Andrew Antoine, Babayan, Steven E, Schmid, Andreas
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Embodiments described herein relate to a substrate support assembly. The substrate support assembly includes an ESC base assembly having a base channel disposed therein, a facility plate, the facility plate coupled to the ESC base assembly with a vacuum region therebetween, and a seal assembly. The seal assembly includes an upper flange coupled to the base channel of the ESC base assembly, the upper flange disposed in the facility plate, a lower flange coupled to the upper flange, the lower flange disposed in the facility plate, a gasket disposed between the upper flange and the lower flange, and an insulator tube coupled to the lower flange. A passage is connected to the base channel, the passage is defined by connected openings of the upper flange, the gasket, the lower flange, the insulator tube, and the base assembly.