Semiconductor device

A method for fabricating a semiconductor device includes forming a first wiring layer, the first wiring layer including a first metal wiring and a first interlayer insulating film wrapping the first metal wiring on a substrate, forming a first via layer, the first via layer including a first via tha...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Moon, Hyo Jeong, Park, Seung Jong, Bae, Seul Gi, Park, Jae Wha, Kim, Jun Kwan, Kim, Moon Keun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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