Photonic integrated circuit devices and methods of forming same

A photonic integrated circuit device includes a semiconductor substrate (e.g., wafer) having a chip region therein, which is bounded on at least one side thereof by a scribe line. The chip region includes an optical transmitter, an optical receiver and a test optical waveguide. This test optical wav...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Cho, Keun Yeong, Ji, Ho-Chul, Byun, Hyunil
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A photonic integrated circuit device includes a semiconductor substrate (e.g., wafer) having a chip region therein, which is bounded on at least one side thereof by a scribe line. The chip region includes an optical transmitter, an optical receiver and a test optical waveguide. This test optical waveguide is coupled to the optical transmitter and the optical receiver and overlaps the scribe line. During a substrate dicing operation, a portion of the test optical waveguide overlapping the scribe line is removed.