Systems and methods for removing an adhesively-attached component from a circuit board assembly

Apparatus and associated methods relate to removing an adhesively-attached component from a circuit board assembly. A complementary pair of high-permeability members are positioned on opposite sides of the circuit board assembly about the adhesively-attached component. Then, a magnetic field is indu...

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Bibliographische Detailangaben
Hauptverfasser:	Dunn, Michael Spencer, Thurber, Lawrence William
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Apparatus and associated methods relate to removing an adhesively-attached component from a circuit board assembly. A complementary pair of high-permeability members are positioned on opposite sides of the circuit board assembly about the adhesively-attached component. Then, a magnetic field is induced within the complementary pair of high permeability members via a coil driver generating an AC current in an inductive coil circumscribing a central pedestal of the complementary pair of high-permeability members. The magnetic field induced is directed through the adhesively-attached component via a central pedestal located proximate the adhesively-attached component. A return path for the magnetic field is provided about a periphery of the adhesively-attached component via a peripheral pedestal.