Electronic component or precursor thereof, and method for manufacturing same

Electronic component or precursor thereof, and method for manufacturing same

An electronic component, or a precursor thereof, that comprises a curable organopolysiloxane composition or a cured product thereof is disclosed. The curable organopolysiloxane composition is generally curable through a hydrosilylation reaction and can be applied to at least one area by a microdropl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Sutoh, Manabu
Format: Patent
Sprache:eng
Schlagworte:
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
SEMICONDUCTOR DEVICES
SPRAYING OR ATOMISING IN GENERAL
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
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Beschreibung
Zusammenfassung:An electronic component, or a precursor thereof, that comprises a curable organopolysiloxane composition or a cured product thereof is disclosed. The curable organopolysiloxane composition is generally curable through a hydrosilylation reaction and can be applied to at least one area by a microdroplet application device. The curable organopolysiloxane composition has a viscosity of no more than 2.0 Pa·s at a strain rate of 1,000 (1/s), and a viscosity at a strain rate of 0.1 (1/s) being a value no less than 50.0 times the viscosity at a strain rate of 1,000 (1/s). In particular, the area of application generally is a substantially circular area that fits within a frame no more than 1000 μm in diameter, a linear area no more than 1000 μm in line width, or a pattern configured from a combination of these areas.