Minimization of insertion loss variation in through-silicon vias (TSVs)

An electronic device package is described. The electronic device package includes one or more dies. The electronic device package includes an interposer coupled to the one or more dies. The electronic device package also includes a package substrate coupled to the interposer. The electronic device p...

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Bibliographische Detailangaben

Hauptverfasser:	Qian, Zhiguo, Mekonnen, Yidnekachew S, Xie, Jianyong, Aygun, Kemal
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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