Thermal management solutions for integrated circuit packages

An integrated circuit package may be formed having at least one heat dissipation structure within the integrated circuit package itself. In one embodiment, the integrated circuit package may include a substrate; at least one integrated circuit device, wherein the at least one integrated circuit devi...

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Bibliographische Detailangaben

Hauptverfasser:	Karhade, Omkar, Uppal, Aastha, Ganesan, Sanka, Dubey, Manish, Modi, Mitul, Mahajan, Ravindranath, Matayabas, Jr., James C, Bai, Yiqun, Cetegen, Edvin, Singh, Kumar Abhishek, Mallik, Debendra, Viswanath, Ram, Deshpande, Nitin, Krajniak, Jan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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