Thermal management solutions for integrated circuit packages

Thermal management solutions for integrated circuit packages

An integrated circuit package may be formed having at least one heat dissipation structure within the integrated circuit package itself. In one embodiment, the integrated circuit package may include a substrate; at least one integrated circuit device, wherein the at least one integrated circuit devi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Karhade, Omkar, Uppal, Aastha, Ganesan, Sanka, Dubey, Manish, Modi, Mitul, Mahajan, Ravindranath, Matayabas, Jr., James C, Bai, Yiqun, Cetegen, Edvin, Singh, Kumar Abhishek, Mallik, Debendra, Viswanath, Ram, Deshpande, Nitin, Krajniak, Jan
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit package may be formed having at least one heat dissipation structure within the integrated circuit package itself. In one embodiment, the integrated circuit package may include a substrate; at least one integrated circuit device, wherein the at least one integrated circuit device is electrically attached to the substrate; a mold material on the substrate and adjacent to the at least one integrated circuit device; and at least one heat dissipation structure contacting the at least one integrated circuit, wherein the at least one heat dissipation structure is embedded either within the mold material or between the mold material and the substrate.