Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

There is provided a technique that includes a process chamber configured to process a substrate; a transfer chamber in communication with a lower portion of the process chamber, and configured to transfer the substrate to a substrate support disposed in the process chamber, and a heating chamber in...

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Bibliographische Detailangaben
Hauptverfasser: Matsui, Tomoya, Hirano, Makoto, Tateno, Hideto
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:There is provided a technique that includes a process chamber configured to process a substrate; a transfer chamber in communication with a lower portion of the process chamber, and configured to transfer the substrate to a substrate support disposed in the process chamber, and a heating chamber in communication with a lower portion of the transfer chamber, and configured to heat the substrate support and the substrate.