Coil device

The present embodiment relates to a coil device.The coil device according to the present embodiment includes: first to third coils including a connecting portion; and a coil frame including an upper receiving portion for housing the first coil, a lower receiving portion for housing the second and th...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Leem, Sung Hyun
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present embodiment relates to a coil device.The coil device according to the present embodiment includes: first to third coils including a connecting portion; and a coil frame including an upper receiving portion for housing the first coil, a lower receiving portion for housing the second and third coils, and a cable fixing portion for fixing each connecting portion of the first to third coils.