Resistive random access memory devices

The present disclosure generally relates to memory devices and methods of forming the same. More particularly, the present disclosure relates to resistive random-access (ReRAM) memory devices. The present disclosure provides a memory device including an opening in a dielectric structure, the opening...

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Bibliographische Detailangaben
Hauptverfasser: Hsieh, Curtis Chun-I, Yi, Wanbing, Jiang, Yi, Kang, Kai, Tan, Juan Boon, Hsu, Wei-Hui
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure generally relates to memory devices and methods of forming the same. More particularly, the present disclosure relates to resistive random-access (ReRAM) memory devices. The present disclosure provides a memory device including an opening in a dielectric structure, the opening having a sidewall, a first electrode on the sidewall of the opening, a spacer layer on the first electrode, a resistive layer on the first electrode and upon an upper surface of the spacer layer, and a second electrode on the resistive layer.