Decorative film and method for producing decorative molded body using same

This decorative film is to be bonded to a resin molded body by means of thermoforming, and comprises a sealing layer (I) that contains a polypropylene resin (A) and a layer (II) that contains a polypropylene resin (B). The polypropylene resin (A) satisfies the requirement (a1), while the polypropyle...

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Bibliographische Detailangaben
Hauptverfasser:	Asuka, Kazuo, Katsuno, Satoshi, Takahashi, Kuninori, Kitaura, Hayato, Niibe, Morikazu
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	This decorative film is to be bonded to a resin molded body by means of thermoforming, and comprises a sealing layer (I) that contains a polypropylene resin (A) and a layer (II) that contains a polypropylene resin (B). The polypropylene resin (A) satisfies the requirement (a1), while the polypropylene resin (B) satisfies the requirement (b1). (a1) The melt flow rate (MFR (A)) (at 230° C. under a load of 2.16 kg) is more than 0.5 g/10 minutes. (b1) The melt flow rate (MFR (B)) (at 230° C. under a load of 2.16 kg) and the MFR (A) satisfy relational expression (b-1). MFR (B)