High power thermally conductive radio frequency absorbers

High power thermally conductive radio frequency absorbers

Radio frequency ("RF") absorbing devices used as RF termination devices or free space absorbers, for example, are formed with a planar wafer made of an inorganic thermally conductive material. The planar wafer has a first surface and a second surface opposite the first surface. A metallize...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Choo, Robert, Reynolds, Robert L, Bieti, Martin W
Format: Patent
Sprache:eng
Schlagworte:
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Radio frequency ("RF") absorbing devices used as RF termination devices or free space absorbers, for example, are formed with a planar wafer made of an inorganic thermally conductive material. The planar wafer has a first surface and a second surface opposite the first surface. A metallized resistive film is disposed on the first surface. A metallized reflective heat sink is disposed on the second surface.