Structure and method for integrated circuit

The present disclosure provides many different embodiments of an IC device. The IC device includes a gate stack disposed over a surface of a substrate and a spacer disposed along a sidewall of the gate stack. The spacer has a tapered edge that faces the surface of the substrate while tapering toward...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Kuang, Shin-Jiun, Sheu, Yi-Ming, Yu, Tsung-Hsing
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure provides many different embodiments of an IC device. The IC device includes a gate stack disposed over a surface of a substrate and a spacer disposed along a sidewall of the gate stack. The spacer has a tapered edge that faces the surface of the substrate while tapering toward the gate stack. Therefore the tapered edge has an angle with respect to the surface of the substrate.