Method for providing a semiconductor device with silicon filled gaps

Method for filling a gap, comprisingproviding in a deposition chamber a semiconductor substrate having a gap, wherein a bottom of the gap includes a crystalline semiconducting material and wherein a side wall of the gap includes an amorphous material;depositing a silicon precursor in the gap.

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Hauptverfasser: Houben, Kelly, Jongbloed, Bert, Pierreux, Dieter, Trovato, Anna, van Aerde, Steven, Verweij, Wilco A
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creator Houben, Kelly
Jongbloed, Bert
Pierreux, Dieter
Trovato, Anna
van Aerde, Steven
Verweij, Wilco A
description Method for filling a gap, comprisingproviding in a deposition chamber a semiconductor substrate having a gap, wherein a bottom of the gap includes a crystalline semiconducting material and wherein a side wall of the gap includes an amorphous material;depositing a silicon precursor in the gap.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11501968B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11501968B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11501968B23</originalsourceid><addsrcrecordid>eNrjZHDxTS3JyE9RSMsvUigoyi_LTMnMS1dIVChOzc1Mzs9LKU0uAcqkpJZlJqcqlGeWZCgUZ-aAZBTSMnNyUlMU0hMLinkYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSXxosKGhqYGhpZmFk5ExMWoAxIkzDw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for providing a semiconductor device with silicon filled gaps</title><source>esp@cenet</source><creator>Houben, Kelly ; Jongbloed, Bert ; Pierreux, Dieter ; Trovato, Anna ; van Aerde, Steven ; Verweij, Wilco A</creator><creatorcontrib>Houben, Kelly ; Jongbloed, Bert ; Pierreux, Dieter ; Trovato, Anna ; van Aerde, Steven ; Verweij, Wilco A</creatorcontrib><description>Method for filling a gap, comprisingproviding in a deposition chamber a semiconductor substrate having a gap, wherein a bottom of the gap includes a crystalline semiconducting material and wherein a side wall of the gap includes an amorphous material;depositing a silicon precursor in the gap.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221115&amp;DB=EPODOC&amp;CC=US&amp;NR=11501968B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221115&amp;DB=EPODOC&amp;CC=US&amp;NR=11501968B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Houben, Kelly</creatorcontrib><creatorcontrib>Jongbloed, Bert</creatorcontrib><creatorcontrib>Pierreux, Dieter</creatorcontrib><creatorcontrib>Trovato, Anna</creatorcontrib><creatorcontrib>van Aerde, Steven</creatorcontrib><creatorcontrib>Verweij, Wilco A</creatorcontrib><title>Method for providing a semiconductor device with silicon filled gaps</title><description>Method for filling a gap, comprisingproviding in a deposition chamber a semiconductor substrate having a gap, wherein a bottom of the gap includes a crystalline semiconducting material and wherein a side wall of the gap includes an amorphous material;depositing a silicon precursor in the gap.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDxTS3JyE9RSMsvUigoyi_LTMnMS1dIVChOzc1Mzs9LKU0uAcqkpJZlJqcqlGeWZCgUZ-aAZBTSMnNyUlMU0hMLinkYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSXxosKGhqYGhpZmFk5ExMWoAxIkzDw</recordid><startdate>20221115</startdate><enddate>20221115</enddate><creator>Houben, Kelly</creator><creator>Jongbloed, Bert</creator><creator>Pierreux, Dieter</creator><creator>Trovato, Anna</creator><creator>van Aerde, Steven</creator><creator>Verweij, Wilco A</creator><scope>EVB</scope></search><sort><creationdate>20221115</creationdate><title>Method for providing a semiconductor device with silicon filled gaps</title><author>Houben, Kelly ; Jongbloed, Bert ; Pierreux, Dieter ; Trovato, Anna ; van Aerde, Steven ; Verweij, Wilco A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11501968B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Houben, Kelly</creatorcontrib><creatorcontrib>Jongbloed, Bert</creatorcontrib><creatorcontrib>Pierreux, Dieter</creatorcontrib><creatorcontrib>Trovato, Anna</creatorcontrib><creatorcontrib>van Aerde, Steven</creatorcontrib><creatorcontrib>Verweij, Wilco A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Houben, Kelly</au><au>Jongbloed, Bert</au><au>Pierreux, Dieter</au><au>Trovato, Anna</au><au>van Aerde, Steven</au><au>Verweij, Wilco A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for providing a semiconductor device with silicon filled gaps</title><date>2022-11-15</date><risdate>2022</risdate><abstract>Method for filling a gap, comprisingproviding in a deposition chamber a semiconductor substrate having a gap, wherein a bottom of the gap includes a crystalline semiconducting material and wherein a side wall of the gap includes an amorphous material;depositing a silicon precursor in the gap.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method for providing a semiconductor device with silicon filled gaps
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-15T12%3A45%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Houben,%20Kelly&rft.date=2022-11-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11501968B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true