Fiber reinforced stiffener

Fiber reinforced stiffener

Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a package substrate, where the package substrate comprises a plurality of buildup layers, and where each buildup layer has fiber reinforcement. In an embo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Pon, Florence, Ramiso, Maria Angela Damille, Leuten, Tyler
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a package substrate, where the package substrate comprises a plurality of buildup layers, and where each buildup layer has fiber reinforcement. In an embodiment, the electronic package further comprises a reinforcement layer, where the reinforcement layer comprises a buildup layer and fiber reinforcement, and where an orientation of the fibers in the reinforcement layer is different than an orientation of the fibers in the package substrate.