Wireless communication system with improved thermal performance

Wireless communication system with improved thermal performance

Aspects of wireless communication are described, including a radiofrequency (RF) amplifier chip, configured for transmitting or receiving data, comprising a first substrate comprising a first material and a second substrate comprising a second material that is different from the first material. The...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Mitchell, Jr., Tyrone D, Saunier, Paul, Ejeckam, Felix, Francis, Daniel, Kong, Kris
Format: Patent
Sprache:eng
Schlagworte:
AIRCRAFT
AVIATION
BASIC ELECTRIC ELEMENTS
COLORIMETRY
COSMONAUTICS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT
MEASURING
PERFORMING OPERATIONS
PHYSICS
RADIATION PYROMETRY
SEMICONDUCTOR DEVICES
TESTING
TRANSMISSION
TRANSPORTING
VEHICLES OR EQUIPMENT THEREFOR
WIRELESS COMMUNICATIONS NETWORKS
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Beschreibung
Zusammenfassung:Aspects of wireless communication are described, including a radiofrequency (RF) amplifier chip, configured for transmitting or receiving data, comprising a first substrate comprising a first material and a second substrate comprising a second material that is different from the first material. The first substrate and the second substrate may be lattice-matched such that an interface region between the first substrate and the second substrate exhibits an sp3 carbon peak at about 1332 cm·1 having a full width half maximum of no more than 5.0 cm·1 as measured by Raman spectroscopy. In some aspects, the first substrate and said second substrate permit said chip to transmit or receive data at a transfer rate of at least 500 megabits per second and a frequency of at least 8 GHz. In some aspects, the RF amplifier chip is part of a satellite transmitter.