Protection of foldable electronics

A foldable thin film device assembly is provided comprising: a flexible thin film device with a thickness smaller than 50 micrometer. The thin film device has a stack of electroactive layers formed on a substrate. A protective inorganic capping layer caps the stack of electroactive layers and a backside elastomeric layer backs the flexible thin film device. A frontside transparent elastomeric layer covers the flexible thin film device, and backside and frontside flexible layers are dimensioned to mechanically form a neutral line for the protective inorganic layer. The elastomeric material has a Young's modulus smaller than 100 MPa smaller than 100 MPa and thickness larger than 100 micron, with a flexural rigidity equal or larger than the thin film device.