Combined pump-sensor arrangement

The invention relates to a combined pump-sensor arrangement having a substrate having a first main surface and an opposite second main surface. A package lid which defines a package having a measuring cavity is arranged on the first main surface of the substrate. Additionally, the pump-sensor arrang...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Richter, Martin, Kutter, Christoph, Roehl, Siegfried, Congar, Yuecel
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING HEATING INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES LIGHTING MEASURING MECHANICAL ENGINEERING PHYSICS POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS PUMPS FOR LIQUIDS OR ELASTIC FLUIDS TESTING WEAPONS
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Beschreibung
Zusammenfassung:	The invention relates to a combined pump-sensor arrangement having a substrate having a first main surface and an opposite second main surface. A package lid which defines a package having a measuring cavity is arranged on the first main surface of the substrate. Additionally, the pump-sensor arrangement has a micropump having a pump inlet and a pump outlet, the micropump being configured to suck in an analyte fluid present in the measuring cavity through the pump inlet and eject the same to an environment outside the measuring cavity via the pump outlet. Furthermore, the pump-sensor arrangement has a sensor for detecting at least one component of the analyte fluid present within the measuring cavity and movable by means of the micropump. In accordance with the invention, both the sensor and the micropump are commonly arranged on the first main surface of the substrate and within the measuring cavity.