Apparatus for cutting material and system for cutting material

The present invention provides an apparatus for cutting a material, comprising: a frame body installed on a conveying path of a material; a cutting means, mounted on the frame body, for cutting an end portion of the material being conveyed; a laser preheating means for preheating the material by irr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Huh, Hyeong-Jun, Kwak, Sung-Joon, Lim, Choong-Soo
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention provides an apparatus for cutting a material, comprising: a frame body installed on a conveying path of a material; a cutting means, mounted on the frame body, for cutting an end portion of the material being conveyed; a laser preheating means for preheating the material by irradiating a laser beam onto the material before being conveyed to the cutting means; and a blocking and reflection means for blocking the laser beams reflected to the cutting means and re-reflecting the laser beam to the material.