Bonding apparatus and bonding method
A bonding apparatus according to the present embodiment includes a first holder and a second holder. The first holder holds a first substrate. The second holder sucks a second substrate, opposes the second substrate to the first substrate, and bonds the second substrate to the first substrate. A fir...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A bonding apparatus according to the present embodiment includes a first holder and a second holder. The first holder holds a first substrate. The second holder sucks a second substrate, opposes the second substrate to the first substrate, and bonds the second substrate to the first substrate. A first ring stage is provided on an outer circumference of the first holder and allows a first ring member provided on an outer edge of the first substrate to be mounted thereon. A second ring stage is provided on an outer circumference of the second holder and allows a second ring member provided on an outer edge of the second substrate to be mounted thereon. A first heater is provided in the first ring stage. A second heater is provided in the second ring stage. |
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