Wafer holding table

A wafer holding table includes a ceramic electrostatic chuck, a metal cooling plate, a resin layer having predetermined thermal resistance, and a stress relaxation layer having lower Young's modulus than the resin layer. The resin layer and the stress relaxation layer are disposed between the electrostatic chuck and the cooling plate. The resin layer is disposed closer to the electrostatic chuck, and the stress relaxation layer is disposed closer to the cooling plate. The resin layer has a multilayer structure including a plurality of resin sheets laminated one on another. The resin layer is thinner than a comparative sample with a single-layer structure made of a material identical to a material of the resin sheet and having thermal resistance identical to thermal resistance of the resin layer.