Submerged underwater electroless, electrochemical deposition of metal on conductive and nonconductive surfaces

Electroless underwater metal plating of a surface of fixed or floating structure is accomplished by transferring to the surface metal ions from a metal precursor in a solid or semisolid electrolyte that is pressed against and moved over a submerged surface. Metal ions from a metal salt blended in th...

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Bibliographische Detailangaben
Hauptverfasser: Arumugam, Ganesh K, Thapa, Sumil S, Nakatsuka, Matthew A
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Electroless underwater metal plating of a surface of fixed or floating structure is accomplished by transferring to the surface metal ions from a metal precursor in a solid or semisolid electrolyte that is pressed against and moved over a submerged surface. Metal ions from a metal salt blended in the solid or semisolid material plate the underwater substrate.