Method for packaging an electronic component in a package with an organic back end

A method for fabricating an array of front ends for an array of packaged electronic components that each comprise:an electrical element packaged within a package comprisinga front part of a package comprising an inner section with a cavity therein opposite the resonator defined by the raised frame and an outer section sealing said cavity; anda back part of the package comprising a back cavity in an inner back section, and an outer back section sealing the cavity, said back package further comprising a first and a second via through the back end around said at least one back cavity for coupling to front and back electrodes of the electronic component; the vias terminating in external contact pads that are coupleable in a 'flip chip' configuration to a circuit board; the method comprising the stages of:i. Obtaining a carrier substrate having an active membrane layer attached thereto by its rear surface, with a front electrode on the front surface of the active membrane layer;ii. Obtaining an inner front end section;iii. Attaching the inner front end section to the exposed front surface of the front electrode;iv. Detaching the carrier substrate from the rear surface of the active membrane layer;v. Optionally thinning the inner front section;vi. Processing the rear surface by removing material to create an array of at least one island of active membrane on at least one island of front electrode;vii. Creating an array of at least one front cavity by selectively removing at least outer layer of the inner front end section, such that there is one cavity opposite each island of membrane on the front side of the front electrode on the opposite side to the island of active membrane;viii. Applying an outer front end section to the inner front end section and bonding the outer front end section to an outer surface of the inner front end section such that the outer front end section spans across and seals the at least one cavity of the array of front cavities.