Lateral mounting of optoelectronic chips on organic substrate
A chip packaging structure that includes an optoelectronic (OE) chip mounted on a first surface of a substrate and whose optically active area is directed laterally; and a lens array for the optoelectronic (OE) chip that is mounted on the first surface of the substrate and faces to the optoelectroni...
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| Zusammenfassung: | A chip packaging structure that includes an optoelectronic (OE) chip mounted on a first surface of a substrate and whose optically active area is directed laterally; and a lens array for the optoelectronic (OE) chip that is mounted on the first surface of the substrate and faces to the optoelectronic (OE) chip, wherein the lens array has inside a reflector reflecting light from a first direction to a second direction, in which the first direction is substantially perpendicular to the second direction. |
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