Method for manufacturing stress-relief-annealing-resistant, low-iron-loss grain-oriented silicon steel
Disclosed is a method for manufacturing stress-relief-annealing-resistant, low-iron-loss grain-oriented silicon steel, the method comprising: carrying out, by means of a pulse laser, scanning grooving on a single surface or two surfaces of a silicon steel sheet after cold rolling, or after decarburi...
Gespeichert in:
Hauptverfasser: | , , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Disclosed is a method for manufacturing stress-relief-annealing-resistant, low-iron-loss grain-oriented silicon steel, the method comprising: carrying out, by means of a pulse laser, scanning grooving on a single surface or two surfaces of a silicon steel sheet after cold rolling, or after decarburizing annealing, or after high temperature annealing or after hot stretching, temper rolling and annealing, and forming several grooves parallel with each other in a rolling direction of the silicon steel sheet, wherein a single pulse time width of the pulse laser is 100 ns or less, and a single pulse peak energy density is 0.05 J/cm2 or more; the energy density of a single scan of a single laser beam is 1 J/cm2 to 100 J/cm2; a beam spot of the pulse laser is a single beam spot or a combination of a plurality of beams spots, the shape of the beam spot is circular or elliptic, and the diameter of the beam spot in a scanning direction is 5 μm to 1 mm, and the diameter thereof in a direction perpendicular to the scanning direction is 5 μm to 300 μm; and when scanning grooving is carried out at the same position on the silicon steel sheet, the product of the number of beam spots of the pulse laser and the scan times is 5 or more. |
---|