Carrier film for transferring microelement
The present invention relates to a carrier film for transferring a microelement, wherein, when a microelement is pressurized, a uniform pressurizing force is provided to the entire microelement, and a damage to the microelement can be prevented. The carrier film for transferring a microelement compr...
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| creator | Lee, Hak Joo Kim, Kwangseop Jung, Hyun June Kim, Chan Yoon, Min Ah Kim, Jae Hyun |
| description | The present invention relates to a carrier film for transferring a microelement, wherein, when a microelement is pressurized, a uniform pressurizing force is provided to the entire microelement, and a damage to the microelement can be prevented. The carrier film for transferring a microelement comprises: a load control layer having a first elastic modulus and having a space formed in a part of the interior thereof; and an adhesive layer having a second elastic modulus that is smaller than the first elastic modulus, the adhesive layer being provided on the upper portion of the load control layer and configured such that a microelement supposed to be transferred to a target substrate is attached thereto. The load control layer has a first zero-rigidity area that maintains a first stress in a first deformation range from a first strain to a second strain. |
| format | Patent |
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The carrier film for transferring a microelement comprises: a load control layer having a first elastic modulus and having a space formed in a part of the interior thereof; and an adhesive layer having a second elastic modulus that is smaller than the first elastic modulus, the adhesive layer being provided on the upper portion of the load control layer and configured such that a microelement supposed to be transferred to a target substrate is attached thereto. The load control layer has a first zero-rigidity area that maintains a first stress in a first deformation range from a first strain to a second strain.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221004&DB=EPODOC&CC=US&NR=11458704B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221004&DB=EPODOC&CC=US&NR=11458704B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Lee, Hak Joo</creatorcontrib><creatorcontrib>Kim, Kwangseop</creatorcontrib><creatorcontrib>Jung, Hyun June</creatorcontrib><creatorcontrib>Kim, Chan</creatorcontrib><creatorcontrib>Yoon, Min Ah</creatorcontrib><creatorcontrib>Kim, Jae Hyun</creatorcontrib><title>Carrier film for transferring microelement</title><description>The present invention relates to a carrier film for transferring a microelement, wherein, when a microelement is pressurized, a uniform pressurizing force is provided to the entire microelement, and a damage to the microelement can be prevented. The carrier film for transferring a microelement comprises: a load control layer having a first elastic modulus and having a space formed in a part of the interior thereof; and an adhesive layer having a second elastic modulus that is smaller than the first elastic modulus, the adhesive layer being provided on the upper portion of the load control layer and configured such that a microelement supposed to be transferred to a target substrate is attached thereto. 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The carrier film for transferring a microelement comprises: a load control layer having a first elastic modulus and having a space formed in a part of the interior thereof; and an adhesive layer having a second elastic modulus that is smaller than the first elastic modulus, the adhesive layer being provided on the upper portion of the load control layer and configured such that a microelement supposed to be transferred to a target substrate is attached thereto. The load control layer has a first zero-rigidity area that maintains a first stress in a first deformation range from a first strain to a second strain.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES |
| title | Carrier film for transferring microelement |
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