Carrier film for transferring microelement

The present invention relates to a carrier film for transferring a microelement, wherein, when a microelement is pressurized, a uniform pressurizing force is provided to the entire microelement, and a damage to the microelement can be prevented. The carrier film for transferring a microelement compr...

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Bibliographische Detailangaben
Hauptverfasser:	Lee, Hak Joo, Kim, Kwangseop, Jung, Hyun June, Kim, Chan, Yoon, Min Ah, Kim, Jae Hyun
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to a carrier film for transferring a microelement, wherein, when a microelement is pressurized, a uniform pressurizing force is provided to the entire microelement, and a damage to the microelement can be prevented. The carrier film for transferring a microelement comprises: a load control layer having a first elastic modulus and having a space formed in a part of the interior thereof; and an adhesive layer having a second elastic modulus that is smaller than the first elastic modulus, the adhesive layer being provided on the upper portion of the load control layer and configured such that a microelement supposed to be transferred to a target substrate is attached thereto. The load control layer has a first zero-rigidity area that maintains a first stress in a first deformation range from a first strain to a second strain.