Liquid cooling interconnect module of a computing system

Example implementations relate to a liquid cooling interconnect module of a computing system, and a tool-less method of assembling the liquid cooling interconnect module having a housing, a biasing member, and an interconnect block. The housing has an interlocking member, a support assembly, and a b...

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Bibliographische Detailangaben
Hauptverfasser:	Zhang, Kai, Tan, Chong S, Allen, Joseph
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING JOINTS OR FITTINGS FOR PIPES LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING PIPES PRINTED CIRCUITS SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING THERMAL INSULATION IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	Example implementations relate to a liquid cooling interconnect module of a computing system, and a tool-less method of assembling the liquid cooling interconnect module having a housing, a biasing member, and an interconnect block. The housing has an interlocking member, a support assembly, and a bore extending between a first end and a second end of the housing. The biasing member is disposed within the bore such that it contacts the support assembly. The interconnect block having a pair of through openings, is configured to be slidably inserted within the bore such that it contacts the biasing member. Further, the interconnect block is configured to compress the biasing member against the support assembly to a compressed position when the interconnect block is inserted into the bore, and the interlocking member is configured to retain the interconnect block within the housing when the biasing member is in the compressed position.