Image sensor device

An image sensor device which can reduce a chip size and power consumption, is disclosed. The image sensor device includes a substrate provided with a first surface and a second surface that are arranged to face each other, a pad disposed at the first surface of the substrate, a line layer disposed below the second surface of the substrate, a first through silicon via (TSV) formed to penetrate the substrate and the line layer, and disposed at one side of the pad, a second TSV formed to penetrate the substrate and the line layer, and disposed at the other side of the pad, and a power-supply switch disposed between the first TSV and the second TSV.